1967-1976 Highlights

• IPC becomes active in the IEC
• Opens membership to colleges and universities
• Establishes Technical Activities Executive Committee (TAEC)
• Forms Committee Chairmen Council (CCC)
• Publishes first study of the US market for PWBs
• Launches Technology Marketing Research Council (TMRC)
• Sponsors the first IPC workshop

1967

IPC Packaging Trends Seminar. From left to right: Robert Swiggett, Photocircuits; Joseph Chenail, Hybrid Integrated Circuits; Jack Kilby, inventor of the semiconductor, Dieter Bergman, Philco Corp.; and C.P. Hill, IBM.

• IPC decides to become more active in the International Electrotechnical Commission (IEC) and names Ken Varker, IBM, as an official member of the IEC Printed Circuit Board Committee.
• A special liaison membership for colleges and universities is established.

1968

By 1968, IPC committees, subcommittees, and working groups have expanded to the point where certain technologies are of concern to more than one group. As a result, IPC’s technical committee structure is revised.

Key contributors to the Component Mounting Handbook. Left to right, Hank Koons, Bell Labs; John DeVore, General Electric; Bert Isaacson, Electralab; and Bob Wathen, Fairchild. Co-chairman Dominick Dellisante, Picatinny Arsenal, is not shown.

The Standards Coordinating Committee is enlarged to include the chairmen of all general technical committees, and the name is changed to the Technical Activities Executive Committee (TAEC). Bernie Kessler, Mica, is named the first chairman of the TAEC.

In addition, a new group, the Committee Chairmen Council (CCC), is formed to include all general committee, subcommittee, and working group chairmen. This IPC Technical Committee structure still exists today.

• IPC releases the Component Mounting Handbook.
• IPC leadership agrees that all future IPC documents will contain metric equivalents.

1969

Shown above are a group of experts from government and industry who met at the U.S. Defense Electronics Supply Center (DESC) to develop a specification for copper foil. Front and center, Bernie Alzua, Mica, who served as the chairman of this joint effort.

In 1969, IPC publishes its first study of the U.S. market for PWBs. The data shows the following types of PWBs produced by U.S. manufacturers:

• A new program is initiated to study potential air and water pollution problems in the PWB industry.
• The first IPC film festival is held: Movies produced by IPC members detailing their technology or markets are presented at semiannual meetings.
• IPC moves its offices to 1717 Howard Street, Evanston, Illinois.

1970

Speakers from the Environmental seminar: In front, Don Dinella, Western Electric, and George Messner, PCK Technology. In back, Jerry Siegmund, MacDermid, and Rod DuBois, Northern Electric.

IPC forms the Environmental Protection Committee with Glenn Affleck, Hewlett Packard, and Jim Rogers, Raytheon, serving as co-chairmen. This committee is now called the Environmental, Health and Safety Committee and continues to be very active in support of the membership.

• The second Round Robin Test Program to evaluate the state-of-the-art technology for multilayer PWBs is completed.
• A comprehensive printed circuit board Design Guide is published.

1971

The experts who served on the historic first “measles” committee. Seated: Frank Papiano, RCA; Dick Castonguay, Mica; Ed Cuneo, Cinch-Graphik; and Chairman Jim Swiggett, Photocircuits. Standing: Arny Andrade, Sandia; George Knox, Uniglass; George Smith, NSA; Charles Moser, Bureau of Engraving; and Dick Sarazin, Norplex.

“Measles” on printed circuit boards continues to be an acceptability issue for the industry, particularly in a down market. Measles rejects can cause a serious blow to struggling companies. As a result, IPC technical committees organize an all-out campaign to understand and address the measles issue.

• All IPC policies and procedures are organized into a policy manual.
• George Messner, PCK Technology, presents the results of Multilayer Round Robin III during IPC’s semiannual meeting.
• A cooperative program with Underwriters Laboratories (UL) is established to reduce unnecessary testing of printed circuit board and laminate materials. This activity still continues today.

1972

Presidents Award Winners, 1972: Seated: Dick Douglas, Fortin; George Morse, Cinch-Graphik and outgoing President of the IPC; and Don Dinella, Westinghouse Electric. Standing: Glenn Affleck, Hewlett Packard; Frank Powell, Mary Eyelet & Stamping; Howard McDaniel, Westinghouse Electric; Dave Luzadis, Bendix; Herb Schacter, Agard; and Dennis Bossi, Ansley Electronics.

A major activity by IPC this year is an upgrade of the structure for the development of IPC standards. Recommendations include:

• Development of a standard format for IPC specifications. The IPC board and TAEC agree that IPC will process all of its standards through the American National Standards Institute (ANSI).
• Agreement that a mechanism should be in place for formal test data to substantiate data used in IPC specifications. (This eventually leads to the development of an IPC Testing Committee.)
• A program is initiated to determine which member companies have test resource facilities and would be willing to undertake cooperative testing programs on subjects in which they have an interest.
• It is recommended that IPC participate more actively in the International Electrotechnical Commission (IEC).
• Under the chairmanship of Joe Poch, Westinghouse Electric, the Flat Cable Handbook is published.

1973

Attendees of the special planning committee for a market seminar were (seated) Dan McMillan, McGraw-Hill; Marv Larson, Bureau of Engraving; and Bill McGinley, Methode; (standing) Meridith Suhr, Collins; Ray Pritchard, IPC; Steve Loud, Owens-Corning; George Messner, Photocircuits; Tom Burke, T.M. Associates; Jeff Montgomery and Charles Hill, Quantum Science; Charles Wolff, Western Electric; Ken Varker, IBM; and Wayne Boucher, The Futures Group. Click on the picture for a larger image.

• IPC Test Methods Manual is published under the chairmanship of George Smith, Department of Defense (DoD).
• A major report on Measles is presented and later included in IPC-A-600, Acceptability of Printed Boards.

1974

Members of the board in 1974 included, seated: Henry Kalmus, Sr., Kalmus & Associates; Jim Swiggett, Photocircuits and President of the IPC; Marv Larson, Bureau of Engraving; and Dennis Stalzer, Graphic Research. Standing: Bill McGinley, Methode; Dave Easton, Agard; George Morse, Cinch-Graphik; George Holmes, TRW; Ted Thomas, Ansley, Bill Hangen, Sheldahl; Dick Zens, Electralab; and Bill Guyette, ACD Litton.

• IPC joins with the National Association of Metal Finishers (NAMF) to interface with the EPA to develop effluent standards impacting all electroplating activities. IPC also participates with NAMF in filing suit against the EPA for their electroplating guidelines.
• The comprehensive Assembly Joining Handbook is published under chairmen John Figliozzi, IBM; John DeVore, General Electric; and Paul Bud, Electrovert.

1975

Market research is one of the key membership benefits offered by IPC. IPC officially forms the Technology Marketing Research Council (TMRC), now called the Executive Market and Technology Forum, to provide customized market research and technology trends to TMRC members.

Members of the original TMRC Steering Committee. Seated: Ken Malgren, Norplex; Milt Smith, Westinghouse; Marv Larson, Bureau of Engraving; Don Goffredo, Chemcut. Standing: Steve Hudson, Owens-Corning; Jerry Siegmund and Charles Cobb, MacDermid; Chris Kalmus, Kalmus & Associates; and Jack McFalls, Western Electric.

• A formal program to develop long-range plans is established.
• IPC co-sponsors a joint industry trade show with the Electrical/Electronics Insulation Conference (E/EIC). (This program continues for three years.)
• IPC Process Effects Handbook is published under co-chairs Jim Cost, Raytheon, and Jack Bramel, Honeywell.
• IPC sponsors the first workshop, a PWB design course held at Boston University. Today, IPC conducts hundreds of workshops a year, which address both technical and management topics.
• Don Dinella, Western Electric, presents data from IPC’s first Round Robin Test Program to evaluate the state-of-the-art technology of the additive process.

1976

President’s Award Recipients: Seated: Irv Ireland, Shipley; Paul Twigg, IBM; Jim Kubik, Hughes; and Gordon Buchi, Ciba-Geigy. Standing; Rene Moser, General Electric; Jack Bramel, Honeywell; Walt Rigling, Martin-Marietta; Bill March, Lawrence Livermore Labs; Tom Sarnowski, Photocircuits, and Jim Dilliplane, Berg. Click on the picture for a larger image.

• IPC works with the U.S. Defense Electronics Supply Center (DESC) to review their approach to developing military specifications. In the past, DESC contracted with outside experts to prepare initial drafts, which were then reviewed by a joint government/industry group. DESC agrees to have future drafts prepared by volunteer experts from IPC member companies, thereby providing a better resource for the initial draft and avoiding any cost to the government (i.e., taxpayers).
• Two special Blue Ribbon Committees are formed on Insulation Resistance and Electromigration.