Product ID |
Document Name |
Status |
ANSI |
DoD |
J-STD-001 |
Requirements for Soldered Electrical and Electronic Assemblies |
Rev D 2/05
Rev. C 3/00
Rev. B 10/96
Rev. A 1/95
Orig. 4/92; Supersedes IPC-S-815 |
04/05 |
04/05 |
J-STD-001CS |
Space Applications Electronic Hardware Addendum for J-STD-001C |
CS 1/04 |
|
|
IPC-HDBK-001 |
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies |
Amend 2 10/05
Amend. 1 12/00
Orig. 3/98 |
|
07/01 |
SMC-TR-001 |
An Introduction to Tape Automated Bonding Fine Pitch Technology |
Orig. 1/89 |
|
|
IT-WP-001 |
Myths of E-Commerce |
Orig. 9/00 |
|
|
SMC-WP-001 |
Soldering Capability White Paper Report |
Orig. 8/91 |
|
|
SMEMA 1.2 |
Mechanical Equipment Interface Standard |
Update IPC-SMEMA-9851 |
|
|
JP002 |
Current Tin Whiskers Theory and Mitigation Practices Guideline |
Orig. 3/06 |
|
|
J-STD-002 |
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
Rev. B 02/03
Rev. A 10/98
Orig. 4/92; Supersedes IPC-S-805 |
Y |
05/95 |
SMC-WP-002 |
An Assessment of the Use of Lead in Electronic Assembly |
Orig. 8/92 |
|
|
J-STD-003 |
Solderability Tests for Printed Boards |
Rev. A 02/03
Original 4/92; Supersedes IPC-S-804 |
Y |
|
SMC-WP-003 |
Chip Mounting Technology |
Orig. 8/93 |
|
|
SMEMA 3.1 |
Fiducial Mark Standard |
|
|
|
J-STD-004 |
Requirements for Soldering Fluxes |
Rev. A 01/04
Orig. 1/95 Supersedes IPC-SF-818 |
Y |
05/95 |
SMC-WP-004 |
Design for Success |
Orig. 4/97 |
|
|
SMEMA 4 |
Reflow Terms and Definitions |
Orig. |
|
|
J-STD-005 |
Requirements for Soldering Pastes |
Amend. 1 6/96
Orig. 1/95 Supersedes IPC-SP-819 |
Y |
05/95 |
SMC-WP-005 |
PWB Surface Finishes |
Orig. 4/97 |
|
|
IPC-HDBK-005 |
Guide to Solder Paste Assessment |
Orig. 1/06 |
|
|
SMEMA 5 |
Screen Printing Terms and Definitions |
Orig. |
|
|
J-STD-006 |
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
Rev. B 01/06
Rev. A 05/01
Orig. 1/95 |
Y |
05/95 |
SMEMA 6 |
Electronics Cleaning Terms and Definitions |
Orig. |
|
|
SMEMA 7 |
Fluid Dispensing Terms and Definitions |
Orig. |
|
|
WP-008 |
Setting up Ion Chromatography Capability |
Orig. 12/05 |
|
|
J-STD-012 |
Implementation of Flip Chip
and Chip Scale Technology |
Orig. 1/96 |
Y |
|
J-STD-013 |
Implementation of Ball Grid Array and Other High Density Technology |
Orig. 7/96 |
Y |
|
IPC-DRM-18 |
Component Identification Desk Reference Manual |
Rev. G 9/03
Rev. F 8/01
Rev. E 8/00
Rev. D 7/99
Rev. C 7/98
Rev. B 2/97
Rev. A 4/96
Orig. 9/95 |
|
|
J-STD-020 |
Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
Rev. C 7/04
Rev. B 7/02
Rev. A 4/99
Orig. 10/96 |
|
|
J-STD-026 |
Semiconductor Design Standard for Flip Chip Applications |
Orig. 8/99 |
|
|
J-STD-027 |
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations |
Orig. 02/03 |
|
|
J-STD-028 |
Performance Standard for Flip Chip Scale Bumps |
Orig. 8/99 |
|
|
J-STD-030 |
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages |
Orig. 9/05 |
|
|
J-STD-032 |
Performance Standard for Ball Grid Array Bumps and Columns |
Orig. 6/02 |
|
|
J-STD-033 |
Packaging and Handling of
Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices |
Rev B 10/05
Rev. A 7/02
Orig. 4/99 |
|
|
J-STD-035 |
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components |
Orig. 4/99 |
|
|
IPC-0040 |
Standards Roadmap for Optoelectronic Assembly and Packaging Technology |
Orig. 5/03 |
|
|
IPC-DRM-40
IPC-DRM-PTH |
Through-Hole Solder Joint Evaluation Desk Reference Manual |
Rev D 11/05
Renamed to DRM-PTH
Rev. E 2/02
Rev. D 7/00
Rev. C 9/99
Rev. B 1/99
Rev. A 8/97
Orig. 5/97 |
|
|
IPC-T-50 |
Terms and Definitions Interconnecting and Packaging Electronic Circuits |
Rev. G 12/03
Rev. F 6/96
Rev. E 7/92
Rev. D 11/88
Rev. C 3/85
Rev. B 6/80
Rev. A 8/76
Orig. 8/75 |
|
|
IPC-DRM-53 |
Introduction to Electronics Assembly |
Orig. 6/00 |
|
|
IPC-DRM-56 |
Wire Preparation & Crimping |
Orig. 07/02 |
|
|
IPC-SC-60 |
Post Solder Solvent Cleaning
Handbook |
Rev. A 8/99
Orig. 4/87 |
10/99 |
|
IPC-SA-61 |
Post-Solder Semi-Aqueous Cleaning Handbook |
Rev. A 6/02
Orig. 7/95 |
|
|
IPC-AC-62 |
Post Solder Aqueous Cleaning Handbook |
Rev. A 1/96
Orig. 12/86 |
|
|
IPC-CH-65 |
Guidelines for Cleaning of Printed Boards and Assemblies |
Rev. A 9/99
Orig. 12/90 |
10/99 |
|
IPC-CS-70 |
Guidelines for Chemical Handling Safety in Printed Board Manufacturing |
Orig. 8/88 Obsolete without replacement |
|
|
IPC-CM-78 |
Guidelines for Surface Mounting and Interconnecting Chip Carriers |
Superseded by IPC-SM-780
Rev. C - 3/88
Orig. 11/83 |
|
|
IPC-MP-83 |
IPC Policy on Metrication |
Orig. 8/85 Obsolete without replacement |
|
|
IPC-PC-90 |
General Requirements for Implementation of Statistical Process Control |
Superseded by IPC-9191
Orig. 10/90 |
|
|
IPC-QS-95 |
General Requirements forImplementation of ISO 9000 Quality Systems |
Obsolete without replacement
Orig. 4/93 |
|
|
IPC-L-108 |
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |
Rev. B 6/90 Superseded by IPC-4101
Rev. A 10/80
Orig. 3/76 |
|
|
IPC-L-109 |
Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards |
Superseded by IPC-4101
Rev. B 7/92
Rev. A 10/80
Orig. 3/76 |
|
|
IPC-L-110 |
Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards |
Rev. A Superseded by IPC-L-109 and IPC-4101 |
|
|
IPC-CC-110 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
Superseded by IPC-4121
Rev. A 12/97
Orig. 1/94 |
|
|
IPC-L-112 |
Specification for Composite Metal Clad Base materials for Printed Boards |
Superseded by IPC-4101
Rev. A 6/92
Orig. 7/81 |
|
|
IPC-L-115 |
Specification for Rigid Metal Clad Base Materials for Printed Boards |
Superseded by IPC-4101
Rev. B 4/90
Rev. A 10/80
Orig. 3/77 |
|
|
IPC-L-120 |
Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates |
Obsolete without replacement |
|
|
IPC-L-125 |
Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
Superseded by IPC-4103
Rev. A 7/92
Orig. 8/83 |
|
|
IPC-L-130 |
Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards |
Superseded by IPC-L-108 and IPC-4101
Orig. 1/77 |
|
|
IPC-DD-135 |
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules |
Orig. 8/95 |
|
|
IPC-EG-140 |
Specification for Finished Fabric Woven from "E" Glass for Printed Boards |
Superseded by IPC-4412
Amend. 1 & 2 6/97
Orig. 3/88 |
|
|
IPC-SG-141 |
Specification for Finished Fabric Woven from "S" Glass for Printed Boards |
Orig. 2/92 |
|
|
IPC-A-142 |
Specification for Finished Fabric Woven from Aramid for Printed Boards |
Orig. 6/90 |
|
|
IPC-QF-143 |
General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards |
Orig. 2/92 |
|
|
IPC-CF-148 |
Resin Coated Metal for Printed Boards |
Rev. A 9/98
Orig. 6/90 |
10/98 |
|
IPC-MF-150 |
Metal Foil for Printed Wiring Applications |
Superseded by IPC-4562
Rev. F 10/91 Changed from CF-150 to MF-150
Rev. E 5/81
Rev. D 3/76
Rev. C 8/74
Rev. B 2/71
Rev. A 9/67
Orig. 8/66 |
|
|
IPC-CF-152 |
Composite Metallic Material Specification for Printed Wiring Boards |
B 12/97
A 1/94
Orig. 6/90 |
|
|
IPC-FC-203 |
Specification for Flat Cable, Round Conductor, Ground Plane |
Obsolete 7/96
Orig. 7/85 |
|
|
IPC-FC-210 |
Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) |
Obsolete 7/96
Orig. 9/85 |
|
|
IPC-FC-213 |
Performance Specification for Flat Undercarpet Telephone Cable |
Obsolete 7/96
Orig. 9/84 |
|
|
IPC-FC-217 |
General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable |
Obsolete 7/96
Reaffirmed 4/90
Orig. 8/82 |
|
|
IPC-FC-218B/EIA-RS-429 |
General Specification for Connectors, Electrical Flat Cable Type |
Obsolete 7/96
Reaffirmed 05/91
Reaffirmed 11/81
Orig. 7/76 |
|
|
IPC-FC-219 |
Environment Sealed Flat Cable Connectors for use in Aerospace Applications |
Obsolete 7/96
Orig. 5/84 |
|
|
IPC-FC-220 |
Specification for Flat Cable, Flat Conductor, Unshielded |
obsolete 7/96
Rev. C 7/85
Rev. B 8/75
Rev. A 1/74
Orig. 5/70 |
|
|
IPC-FC-221 |
Specification for Flat-Copper Conductors for Flat Cables |
Obsolete 7/96
Rev. A 5/84
Orig. 8/75 |
|
|
IPC-FC-222 |
Specification of Flat Cable Round Conductor, Unshielded |
Obsolete 7/96
5/91 Reaffirmed
Orig. 6/80 |
|
|
IPC-FC-225 |
Flat Cable Design Guide |
Obsolete (date)
10/85 Reaffirmed
Orig. 8/75 |
|
|
IPC-FC-231 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
Superseded by IPC-4202
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74 |
|
|
IPC-FC-232 |
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films |
Superseded by 4203
Amend. 10/95
Rev. C 6/94
Rev. B 2/86
Rev. A 5/83
Orig. 7/74 |
|
|
IPC-FC-233 |
Flexible Adhesive Bonding Films |
Incorporated into IPC-FC-232B |
|
|
IPC-FC-234 |
PSA Assembly Guidelines for
Single- & Double-Sided Flexible Printed Circuits |
Orig. 12/97 |
|
|
IPC-FC-240 |
Single sided flex |
Superseded by IPC-6013
Incorporated into FC-250
Rev. B 1/74
Rev. A 5/69
Orig. 12/65 |
|
|
IPC-FC-241 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring |
Superseded by IPC-4204
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74 |
|
|
IPC-RF-245 |
Performance Specification for Rigid-Flex Printed Boards |
Superseded by IPC-6013
Orig. 4/87 |
|
|
IPC-D-249 |
Design Standard for Flexible Single-and Double-Sided Printed Boards |
Superseded by IPC-2223
Orig. 1/87 |
|
|
IPC-FC-250A |
Specification for Single - and Double-Sided Flexible Printed Wiring |
Superseded by IPC-6013
Rev. A 9/86
Orig. 9/86 |
|
|
IPC-FA-251 |
Guidelines for Single and Double Sided Flex Circuits |
Orig. 2/92 |
|
|
IPC-D-275 |
Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
Superseded by IPC-2221 and 2222
Supersedes IPC-D-319 and IPC-D-949
Amendment.1 4/96
Orig. 9/91 |
|
|
IPC-RB-276 |
Qualification and Performance Specification for Rigid Printed Boards |
Superseded by IPC-6011 and IPC-6012
Orig. 3/92 Supersedes IPC-SC-320B and IPC-ML-950C |
|
|
IPC-D-279 |
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies |
Orig. 7/96 |
|
|
IPC-D-300 |
Printed Board Dimensions and Tolerances |
Superseded by IPC-2615
Rev. G 1/84
Rev. F 11/74
Rev. E 10/70
Rev. D 1/70
Rev. C 10/65
Rev. B 1/64
Rev. A 7/61
Orig. 8/60 |
|
|
IPC-D-310 |
Guidelines for Phototool Generation and Measurement Techniques |
Rev. C 06/91
Rev. B 12/85
Rev. A 12/77
Orig. 9/69 |
|
|
IPC-A-311 |
Process Control Guidelines for Phototool Generation and Use |
Orig. 3/96 |
|
|
IPC-D-316 |
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates |
Superseded by IPC-2252
Orig. 5/95 |
|
|
IPC-D-317 |
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques |
Superseded by IPC-2251
Rev. A 1/95
Orig. 4/90 |
|
|
IPC-HF-318 |
Microwave End Product Board Inspection and Test |
Superseded by IPC-6018
Rev. A 12/91
Orig. 6/85 |
|
|
IPC-D-319 |
Design Standard for Rigid Single-and Double-Sided Printed Boards |
Superseded by IPC-D-275, then by IPC-2221/2222
Orig. 1/87 |
|
|
IPC-SD-320 |
Performance Specification for Rigid Single- and Double-Sided Printed Boards |
Superseded by IPC-RB-276
Supersedes IPC-TC-500
Rev. B 11/86
Rev. A 3/81
Orig. 1/77 |
|
|
IPC-D-322 |
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes |
Reaffirmed 9/91
Orig. 8/84 |
|
|
IPC-MC-324 |
Performance Specifications for Metal Core Boards |
Superseded by IPC-6011 and IPC-6012
Orig. 10/88 |
|
|
IPC-D-325 |
Documentation Requirements for Printed Boards, Assemblies and Support Drawings |
Rev. A 5/95
Orig. 1/87 |
|
|
IPC-D-326 |
Information Requirements for Manufacturing Printed Board Assemblies |
Rev. A 1/04
Orig. 4/91 |
|
|
IPC-D-330 |
Design Guide Manual |
Date |
|
|
IPC-PD-335 |
Electronic Packaging Handbook |
Orig. 12/89 |
|
|
IPC-NC-349 |
Computer Numerical Control Formatting for Drillers and Routers |
Orig. 8/85 |
|
|
IPC-D-350 |
Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 |
Rev. D 7/92
Rev. C 10/85
Rev. B 8/77
Rev. A 2/75
Orig. 8/72 |
|
|
IPC-D-351 |
Printed Board Drawings in Digital Form |
Orig. 8/85 |
|
|
IPC-D-352 |
Electronic Design Data Description for Printed Boards in Digital Form |
Orig. 8/85 |
|
|
IPC-D-354 |
Library Format Description for Printed Boards in Digital Form |
Orig. 2/87 |
|
|
IPC-D-355 |
Printed Board Assembly Description in Digital Form |
Orig. 1/95 |
|
|
IPC-D-356 |
Bare Board Electrical Test
Information in Digital Form |
Rev. B 10/02
Rev. A 1/98
Orig. 3/92 |
|
|
IPC-AM-361 |
Specification for Rigid Substrates for Additive Process Printed Boards |
Superseded by IPC-4101
Orig. 1/82 |
|
|
IPC-MB-380 |
Guidelines for Molded Interconnection Devices |
Orig. 10/90 |
|
|
IPC-D-390 |
Automated Design Guidelines |
Rev. A 2/88
Orig. 7/74 |
|
|
IPC-C-406 |
Design and Application Guidelines for Surface Mount Connectors |
Orig. 1/90 |
|
|
IPC-CI-408 |
Design and Application Guidelines for the Use of Solderless Surface Mount Connectors |
Orig. 1/94 |
|
|
IPC-BP-421 |
General Specification for Rigid Printed Board Backplanes with Press Fit Contacts |
Obsolete without replacement
Reaffirmed 4/90
Orig. 10/80 |
|
|
IPC-D-422 |
Design Guide for Press Fit Rigid Printed Board Backplanes |
Orig. 9/82 |
|
|
IPC-DW-424 |
General Specification for Encapsulated Discrete Wire Interconnection Boards |
Orig. 1/95 |
|
|
IPC-DW-425 |
Design and End Product Requirements for Discrete Wiring Boards |
Rev. A 5/90
Orig. 9/82 |
|
|
IPC-DW-426 |
Specifications for Assembly of Discrete Wiring |
Orig. 12/87 |
|
|
IPC-TR-460 |
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards |
Rev. A 2/84
Orig. 1973 |
|
|
IPC-TR-461 |
Solderability Evaluation of Thick and Thin Fused Coatings |
Orig. 3/79 |
|
|
IPC-TR-462 |
Solderability Evaluation of
Printed Boards with Protective Coatings Over Long Term Storage |
Orig. 10/87 |
|
|
IPC-TR-464 |
Accelerated Aging for Solderability Evaluations |
Rev. A 12/87
Orig. Pub.4/84 |
|
|
IPC-TR-465-1 |
Round Robin Test on Steam Ager Temperature Control Stability |
Orig. 1993 |
|
|
IPC-TR-465-2 |
The Effect of Steam Aging Time and Temperature on Solderability Test Results |
Orig. 1993 |
|
|
IPC-TR-465-3 |
Evaluation of Steam Aging on Alternative Finishes, Phase IIA |
Orig. 7/96 |
|
|
IPC-TR-466 |
Wetting Balance Standard Weight Comparison Test |
Orig. 4/95 |
|
|
IPC-TR-467 |
Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D |
Orig. 10/96 |
|
|
IPC-TR-468 |
Factors Affecting Insulation Resistance Performance of Printed Boards |
Orig. 3/79 |
|
|
IPC-TR-470 |
Thermal Characteristics of Multilayer Interconnection Boards |
Orig. 1/74 |
|
|
IPC-TR-474 |
An Overview of Discrete Wiring Techniques |
Obsolete without replacement
Reprint 1984
Orig. 3/79 |
|
|
IPC-TR-476 |
How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical
Migration Electrically Induced Failures In Printed Assembles |
Rev. A 6/84 (new title)
Orig. 9/77 |
|
|
IPC-TR-480 |
Results of Multilayer Test Program Round Robin IV Phase I |
Obsolete without replacement
Orig. 9/75 |
|
|
IPC-TR-481 |
Results of Multilayer Test Program Round Robin V |
Orig. 4/81 |
|
|
IPC-TR-482 |
New Developments in Thin Copper Foils |
Orig. 1/76 |
|
|
IPC-TR-483 |
Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program |
Rev. A 3/91
Addendums 10/87
Orig. 4/84 |
|
|
IPC-TR-484 |
Results of IPC Cooper Foil Ductility Round Robin Study |
Orig. 4/86 |
|
|
IPC-TR-485 |
Results of Cooper Foil Rupture Strength Test Round Robin Study |
Orig. 3/85 |
|
|
IPC-TR-486 |
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations |
Orig. 07/01 |
|
|
IPC-TR-549 |
Measles in Printed Wiring Boards |
Orig. 11/78 |
|
|
IPC-TR-551 |
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components |
Orig. 7/93 |
|
|
IPC-DR-570 |
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards |
Obsolete without replacement
Rev. A 4/84
Orig. 1/79 |
|
|
IPC-DR-572 |
Drilling Guidelines for Printed Boards |
Orig. 4/88 |
|
|
IPC-TR-576 |
Additive Process Evaluation |
Obsolete without replacement
Orig. 9/77 |
|
|
IPC-TR-578 |
Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards |
Orig. 9/84 |
|
|
IPC-TR-579 |
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards |
Orig. 9/88 |
|
|
IPC-TR-580 |
Cleaning and Cleanliness Test Program Phase 1 Test Results |
Orig. 10/89 |
|
|
IPC-TR-581 |
IPC Phase 3 Controlled Atmosphere Soldering Study |
Orig. 8/94 |
|
|
IPC-TR-582 |
IPC Phase 3 No-Clean Flux Study |
Orig. 11/94 |
|
|
IPC-TR-583 |
An In-Depth Look At Ionic Cleanliness Testing |
Orig. 7/02 |
|
|
IPC-WP/TR-584 |
IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies |
Orig. 04/03 |
|
|
IPC-TR-585 |
Time, Temperature and Humidity Stress of Final Board Finish Solderability |
Orig. 05/06 |
|
|
IPC-A-600 |
Acceptability of Printed Boards |
Rev. G 07/04
Rev. F 11/99
Rev. E 8/95
Rev. D '89
Rev. C '78
Rev. B '74
Rev. A '70
Orig. '64 |
|
|
IPC-SS-605 |
Printed Board Quality Evaluation Slide Set |
Obsolete without replacement |
|
|
IPC-QE-605 |
Printed Board Quality Evaluation Handbook |
Rev. A 2/99 |
|
|
IPC-A-610 |
Acceptability of Electronic Assemblies |
Rev. D 2/05
Rev. C 1/00
Rev. B 12/94
Rev. A 3/90
Orig. 8/83 |
04/05 |
04/05 |
IPC-HDBK-610 |
Handbook and Guide to IPC-A-610 (Includes B-C-D comparison) |
Amend 1 10/05
Orig. 9/02 |
|
|
IPC-QE-615 |
Assembly Quality Evaluation Handbook |
Obsolete without replacement |
|
|
IPC/WHMA-A-620 |
Acceptability of Electronic Wire Harnesses and Cables |
Rev A 07/06
Orig. 01/02 |
03/02 |
|
IPC-AI-640 |
User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates |
Obsolete without replacement
Orig. 1/87 |
|
|
IPC-AI-641 |
User's Guidelines for Automated Solder Joint Inspection |
Obsolete without replacement
Orig. 1/87 |
|
|
IPC-AI-642 |
User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's |
Obsolete without replacement
Orig. 10/88 |
|
|
IPC-OI-645 |
Standard for Visual Optical Inspection Aids |
Orig. 10/93 |
|
|
IPC-TM-650 |
Test Methods Manual |
Updated per test method |
|
|
IPC-ET-652 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
Orig. 10/90 Superseded by IPC-9252 |
|
|
IPC-QL-653 |
Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material |
Rev. A 11/97
Orig. 8/88 |
|
|
IPC-MI-660 |
Incoming Inspection of Raw Materials Manual |
Orig. 2/84 |
|
|
IPC-R-700 |
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies |
Superseded by IPC-7711A/7721A
C 1/88
B 9/77
A 12/71
Orig. 9/67 |
|
|
IPC-TA-720 |
Technology Assessment Handbook on Laminates |
Orig. ’86 |
|
|
IPC-TA-721 |
Technology Assessment Handbook on Multilayer Boards |
Orig. ’88 |
|
|
IPC-TA-722 |
Technology Assessment of Soldering |
Orig. ’90 |
|
|
IPC-TA-723 |
Technology Assessment Handbook on Surface Mounting |
Orig. ’91 |
|
|
IPC-TA-724 |
Technology Assessment Series on Cleanrooms |
Orig. 4/98 |
|
|
IPC-PE-740 |
Troubleshooting Guide for Printed Board Manufacture and Assembly |
Rev. A 12/97
Orig. 1/85 |
|
|
IPC-CM-770 |
Printed Board Component Mounting |
Rev. E 1/04
Rev. D 1/96
Rev. C 1/87
Rev. B 10/80
Rev. A 3/76
Orig. 9/68 |
|
|
IPC-SM-780 |
Component Packaging and Interconnecting with Emphasis on Surface Mounting |
Orig. 3/88 |
|
|
IPC-SM-782 |
Surface Mount Design and Land Pattern Standard |
Superseded by IPC-7351
Amend. 2 04/99
Amend. 1 10/96
Rev. A 8/93
Orig. 3/87 |
|
|
IPC-SM-784 |
Guidelines for Chip-on-Board Technology Implementation |
Orig. 11/90 |
|
|
IPC-SM-785 |
Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments |
Orig. 11/92 |
|
|
IPC-SM-786 |
Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs |
Superseded by J-STD-020 and J-STD-033
Rev. A 1/95
Orig. 12/90 |
|
|
IPC-MC-790 |
Guidelines for Multichip Module Technology Utilization |
Orig. 8/92 |
|
|
IPC-S-801 |
|
Superseded by IPC-804 and J-STD-003 |
|
|
IPC-S-803 |
|
Superseded by IPC-804 and J-STD-003 |
|
|
IPC-S-804 |
Solderability Test Methods for Printed Wiring Boards |
Superseded by J-STD-003
Rev. A 1/87
Orig. 1/82 |
|
|
IPC-S-805 |
Solderability Tests for Component Leads and Terminations |
Superseded by
J-STD-002
Orig. 1/85 |
|
|
IPC-MS-810 |
Guidelines for High Volume Microsection |
Orig. 10/93 |
|
|
IPC-S-815 |
General Requirements for Soldering Electronic Interconnections |
Superseded byJ-STD-001
Rev. B 12/87
Rev. A 6/81
Orig. 11/77 |
|
|
IPC-S-816 |
SMT Process Guideline and Checklist |
Orig. 7/93 |
|
|
IPC-SM-817 |
General Requirements for Dielectric Surface Mounting Adhesives |
Orig. 11/89 |
|
|
IPC-SF-818 |
General Requirement for Electronic Soldering Fluxes |
Superseded by J-STD-004
Rev. 12/91
Orig. 2/88 |
|
|
IPC-SP-819 |
General Requirements and Test Methods for Electronic Grade Solder Paste |
Orig. 10/88 Superseded by J-STD-005 |
|
|
IPC-AJ-820 |
Assembly and Joining Manual |
Orig. 8/96 |
|
|
IPC-CA-821 |
General Requirements for Thermally Conductive Adhesives |
Orig. 1/95 |
|
|
IPC-CC-830 |
Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies |
Rev B 08/02
Amend. 1 7/99
Rev. A 10/98
Orig. 1/84 |
08/02 |
|
IPC-HDBK-830 |
Conformal Coating Handbook |
Orig. 10/02 |
|
|
IPC-SM-839 |
Pre and Post Solder Mask Application Cleaning Guidelines |
Orig. 4/90 |
|
|
IPC-SM-840 |
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards |
Amend. 1 6/00
Rev. C 1/96
Rev. B 5/88
Rev. A 7/83
Orig. 11/77 |
8/00 |
|
IPC-HDBK-840 |
Solder Mask Handbook |
Orig. 09/06 |
|
|
IPC-H-855 |
Hybrid Microcircuit Design Guide |
Obsolete without replacement
Orig. 10/82 |
|
|
IPC-D-859 |
Design Standard for Thick Film Multilayer Hybrid Circuits |
Orig. 12/89 |
Y |
|
IPC-HM-860 |
Specification for Multilayer Hybrid Circuits |
Orig. 1/87 |
Y |
|
IPC-TF-870 |
Qualification and
Performance of Polymer Thick Film Printed Boards |
Orig. 11/89 |
Y |
|
IPC-ML-910 |
Design and End Production Specification for Rigid Multilayer Printed Boards |
Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011 for End Product Specification
Rev. A 08/76
Orig. 06/68 |
|
|
IPC-D-949 |
Design Standard for Rigid Multilayer Printed Boards |
Superseded by IPC-D-275 and subsequently by IPC-2221/2222
Orig. 1/87 |
|
|
IPC-ML-950 |
Performance Specification for Rigid Multilayer Printed Boards |
Superseded by IPC-RB-276 and subsequently IPC-6011/6012
Rev. C 11/8
Rev. B 12/77
Rev. A 9/70
Orig. 1/66 |
|
|
IPC-ML-960 |
Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards |
Orig. 7/94 |
Y |
|
IPC-ML-975 |
End Product Documentation Specification for Multilayer Printed Wiring Boards |
Superseded by IPC-D-325
Orig. 9/69 |
|
|
IPC-ML-990 |
Performance Specification for Flexible Multilayer Wiring |
Superseded by IPC-6011
Orig. 9/72 |
|
|
IPC-1043 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 |
Orig. 8/92 |
|
|
IPC-1044 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 |
Orig. 10/92 |
|
|
IPC-1065 |
Material Declaration Handbook |
Orig. 01/05 |
|
|
IPC-1066 |
Labeling of PCBs and Assemblies |
Orig. 12/04 |
|
|
IPC-TP-1090 |
The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or
MT-0002 |
Orig. 7/96 |
|
|
IPC-TP-1103 |
Manufacturing Concerns When Soldering with Gold Plated Component
Leads or Circuit Board Pads |
Obsolete without replacement |
|
|
IPC-TP-1114 |
The Layman's Guide to Qualifying a Process to J-STD-001B |
Orig. 1/98 |
|
|
IPC-TP-1115 |
Selection and Implementation Strategy for A Low-Residue No-Clean
Process |
Orig. 12/98 |
|
|
IPC-1131 |
IT Guidelines for PWB Manufacturers |
Orig. 04/00 |
|
|
IPC-1331 |
Voluntary Safety Standard for Electrically Heated Process Equipment |
Orig. 3/00 |
|
|
IPC-1710 |
OEM Standard for Printed
Board Manufacturers' Qualification Profile (MQP) |
Rev. A 7/04
12/97 updated
Orig. 2/94 |
|
|
IPC-1720 |
Assembly Qualification Profile (AQP) |
Rev. A 7/04
Orig. 7/96 |
|
|
IPC-1730 |
Laminator Qualification Profile (LQP) |
Rev. A 6/00
Orig. 1/98 |
|
|
IPC-1731 |
Strategic Raw Materials Supplier Qualification Profile |
Orig. Pub. 6/00 |
|
|
IPC-1751 |
Generic Requirements for Declaration Process Management |
Orig. Pub. 3/06 |
|
|
IPC-1752 |
Materials Declaration Management (Includes 2 PDF forms) |
Orig. Pub. 3/06 |
|
|
IPC-1902 |
Grid Systems for Printed Circuits (equivalent to IEC 60097) |
Orig. Pub. 03/99 |
|
|
IPC-2141 |
Controlled Impedance Circuit Boards and High Speed Logic Design |
Rev. A 3/04
Orig. 4/96 |
|
|
IPC-2221 |
Generic Standard on Printed Board Design |
Rev. A 5/03
Amend. 1 01/00
Supersedes IPC-D-275
Orig. 2/98 |
|
|
IPC-2222 |
Sectional Design Standard for Rigid Organic Printed Boards |
Supersedes IPC-D-275
Orig. 2/98 |
|
|
IPC-2223 |
Sectional Design Standard for Flexible Printed Boards |
Rev. A 06/04
Supersedes IPC-D-249
Orig. 11/98 |
|
|
IPC-2224 |
Sectional Standard for Design of PWBs for PC Cards |
Orig. 01/98 |
|
|
IPC-2225 |
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
Orig. 05/98 |
|
|
IPC-2226 |
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures |
Orig. 4/03 |
|
|
IPC-2251 |
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques |
Orig. 12/03 |
|
|
IPC-2252 |
Design and Manufacturing Guide for RF/Microwave Circuit Boards |
Orig. 7/02 |
|
|
IPC/JPCA-2315 |
Design Guide for High Density Interconnects (HDI) and Microvia |
Orig. 6/00 |
|
|
IPC-2501 |
Definition for Web-based Exchange of XML Data |
Orig. 7/03 |
Y |
|
IPC-2511 |
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology |
Rev. B 1/02
Rev A 01/00
Orig. 11/98 |
Y |
|
IPC-2512 |
Sectional Requirements for Implementation of Administrative Methods
for Manufacturing Data Description |
Rev A 11/00
Orig. 11/98 |
|
|
IPC-2513 |
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description |
Rev A 11/00 |
|
|
IPC-2514 |
Sectional Requirements for Implementation of Printed Board Manufacturing Data Description |
Rev A 11/00 |
|
|
IPC-2515 |
Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description |
Rev A 11/00 |
|
|
IPC-2516 |
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description |
Rev A 11/00 |
|
|
IPC-2517 |
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description – 2-11gChair, Bob Neal, Agilent Technologies |
Rev A 11/00 |
|
|
IPC-2518 |
Sectional Requirements for Implementation of Part List Product Data Description - Chair, Harry Parkinson, Parkinson Consulting |
Rev A 11/00 |
|
|
IPC-2524 |
PWB Fabrication Data Quality Rating System |
Orig. 02/99 |
|
|
IPC-2531 |
Standard Recipe File Format Specification |
Orig. 03/99 |
|
|
IPC-2541 |
Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication |
Orig. 10/01 |
Y |
|
IPC-2546 |
Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication |
Amend. 1 01/03
Amend. 2 01/05
Orig. 10/01 |
Y |
|
IPC-2547 |
Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication |
01/02 |
Y |
|
IPC-2571 |
Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) |
11/01 |
Y |
|
IPC-2576 |
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Exchange (PDX) |
11/01 |
Y |
|
IPC-2578 |
Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) |
11/01 |
Y |
|
IPC-2581 |
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) |
Orig. 3/04 |
Y |
|
IPC-2615 |
Printed Board Dimensions and Tolerances |
Supersedes IPC-D-300
Orig. 06/00 |
Y |
|
IPC-3406 |
Guidelines for Electrically Conductive Surface Mount Adhesives |
Orig. 7/96 |
|
|
IPC-3408 |
General Requirements for Anistropically Conductive Adhesive Films |
Orig. 11/96 |
|
|
IPC-4101 |
Specification for Base Materials for Rigid and Multilayer Boards |
Rev. A Amend 1 6/02
Rev. A 06/02
Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
Orig. 12/97
|
TBA |
|
IPC-4103 |
Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection |
Supersedes IPC-L-125
Orig. 01/02 |
Y |
|
IPC/JPCA-4104 |
Specification for High Density Interconnect (HDI) and Microvia Materials |
Orig. 5/99 |
05/99 |
|
IPC-4110 |
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards |
Orig. 8/98 |
10/98 |
|
IPC-4121 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
Supersedes IPC-CC-110A
Orig. 1/00 |
|
|
IPC-4130 |
Specification and Characterization Methods for Nonwoven "E" Glass Mat |
Orig. 9/98 |
12/99 |
|
IPC-4202 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
Supersedes IPC-FC-231C
Orig. 05/02 |
06/02 |
02/03 |
IPC-4203 |
Adhesive Coated Dielectric Films for Use as Cover Sheets |
Supersedes IPC-FC-232C
Orig. 05/02 |
06/02 |
02/03 |
IPC-4204 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of |
Supersedes IPC-FC-241C
Orig. 05/02 |
06/02 |
02/03 |
IPC-4411 |
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement |
Rev. A 11/03
Orig. 4/99 |
|
|
IPC-4412 |
Specification for Finished Fabric Woven form "E" Glass for Printed Boards |
Supersedes IPC-EG-140A
Orig. 06/02 |
07/02 |
02/03 |
IPC-4552 |
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards |
Orig. 10/02 |
11/02 |
|
IPC-4553 |
Specification for Immersion Silver Plating for Printed Circuit Boards |
Orig. 06/05 |
09/06 |
|
IPC-4562 |
Metal Foil for Printed Wiring Applications |
Amend. 1
Supersedes IPC-MF-150F
Orig. 5/00 |
05/05
09/00 |
02/03 |
IPC-4761 |
Design Guide for Protection of Printed Board Via Structures |
Orig. 07/06 |
|
|
IPC-4821 |
Specification for Embedded
Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards |
Orig. 05/06 |
|
|
IPC-5701 |
Users Guide for Cleanliness of Unpopulated Printed Boards |
Orig. 7/03 |
|
|
IPC-6011 |
Generic Performance Specification for Printed Boards |
Orig. 7/96 |
|
|
IPC-6012 |
Qualification and Performance Specification for Rigid Printed Boards |
Rev. B 08/04
Amend. 1 07/00
Rev. A 10/99
Orig. 7/96 |
|
|
IPC-6013 |
Qualification and Performance Specification for Flexible Printed Boards |
Rev. A with Amend. 2 04/06
Amend. 1 01/05
Rev. A 11/03
Supersedes IPC-RF-245 and IPC-FC-250
Amend. 1 04/00
Orig. 11/98 |
|
|
IPC-6015 |
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
Orig. 2/98 |
|
|
IPC-6016 |
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards |
Orig. 05/99 |
8/99 |
|
IPC-6018 |
Microwave End Product Board Inspection and Test |
Rev. A 01/02
Orig. 1/98 |
Y |
|
IPC/JPCA-6202 |
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards |
Orig. 2/99 |
|
|
IPC/JPCA-6801 |